HYPERLYNX TUTORIAL PDF

Hyperlynx tutorial. Hi,Any one have Hyperlynx tutorial book. Please share. Thanks and Regards,Sankar.

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I hope you had a chance to go through and digest the content from the earlier post, where we discussed the basics of Signal integrity Simulations, and the models required to run them.

If you haven't, I would highly recommend going over the post here before proceeding with this entry. This is used for Pre-Layout simulations and is an early simulation tool in the design cycle. It is used to evaluate what-if scenarios and to help define board parameters and routing guidelines. Because it uses the layout file containing the routing constraints along with information on the adjacent nets routing and distance, the simulations will be highly accurate.

Any violations or changes required can be explored in LineSim and fed back into the layout before signing off on the final PCB to be fabricated. During this series, LineSim and Boardsim will be used as and when needed, depending on the topic being discussed. Save the schematic setup. The RX waveform Green and TX waveform Red do not have clean transitions and these will be discussed in more detail in later topics in the series.

Select the necessary settings for the model. This will complete the schematic. This will open up the Digital Oscilloscope window. This places the Simulation probe at the pin and represents what you would see in a lab oscilloscope if you physically probed at the pin on the board.

This places the Simulation probe inside the die and represents what the die sees, which cannot be probed on the board. The layer stackup for the PCB needs to be defined for the dielectric material, metal type, arrangement of signal and plane layers in a board among other items. Setting this up before running simulations helps to mimic the PCB, along with various characteristics such as trace impedance, trace separation and other parameters.

As seen in the above figure, the Editor has various tabs and a quick description of the tabs. Dielectric: Define the dielectric characteristics of the stackup such as technology, loss tangent, and thermal conductivity. There is an option to calculate the dielectric constant for the metal layer from surrounding dielectric layers.

Z0 Planning: Define the characteristic impedance of the stackup. This planning tab is one of the most useful tabs as it enables you to calculate the optimal data when you need a specific target impedance for single and differential pair traces.

Custom View: Used to set up a customized view of the spreadsheet information derived from the other tabs and to tweak per user preference.

There are various methods to set the impedance in the stackup editor, however we will use the Metal tab to quickly set the required impedances. This enables automatic characteristic impedance calculation by the tool based on the stackup.

Select the Metal tab and set the Thickness of Dielectric as below. Note Z0 for the signal layers. Use the Z0 Planning Tab to check the required trace width and separation needed for a target impedance of a single trace and differential pair.

The Trace widths required to achieve these impedances are shown. The strategy for trace separation for differential can also be followed to meet the Target Z0, by choosing Solve for Separation.

The strategy also includes an option to use both, i. Solve for width and Solve for Separation, and results shown in the Z0 Curve column. Now that the stackup is created, it can be exported to be reused for future designs and simulations to save time. I will now leave you to use the steps we discussed above to familiarize yourself with the tool and interface. You must be a registered user to add a comment.

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Showing results for. Search instead for. Did you mean:. Signal Integrity Simulation - Getting started: Part 1. LineSim : This is used for Pre-Layout simulations and is an early simulation tool in the design cycle.

Probing at the die: This places the Simulation probe inside the die and represents what the die sees, which cannot be probed on the board. Defining Stackup The layer stackup for the PCB needs to be defined for the dielectric material, metal type, arrangement of signal and plane layers in a board among other items. Manufacturing: Define metal surface roughness and trace etch parameters. Refer to the Hyperlynx User Guide for advanced details on these tabs. The Trace widths required to achieve these impedances are updated.

Note: The stackup creation for a PCB design is one of the most important and critical steps during the design process and requires time and effort based on complexity.

However, the steps described above are designed to give an insight into the editor and to provide a stackup for future designs and simulations in the series only. They are not based on any design parameters. Tags 5. Tags: Hyperlynx. Latest Articles. Xilinx Online Support Resources - where to find th

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I hope you had a chance to go through and digest the content from the earlier post, where we discussed the basics of Signal integrity Simulations, and the models required to run them. If you haven't, I would highly recommend going over the post here before proceeding with this entry. This is used for Pre-Layout simulations and is an early simulation tool in the design cycle. It is used to evaluate what-if scenarios and to help define board parameters and routing guidelines. Because it uses the layout file containing the routing constraints along with information on the adjacent nets routing and distance, the simulations will be highly accurate.

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